DEPARTMENT OF MECHANICAL AND MATERIALS ENGINEERING
Ahsan Mian

Vita

Teaching

Publications

Research

Journal Articles

  1. N. Lambert, M. A. Karim, K. McNear, C. Witt, D. Muncy, T. Finley, G. Arbuckle, B. Reaka, A. Mian, M. P. Jahan, “A Comparative Experimental Study on the Machinability of 3D Printed and Wrought Inconel 718 Alloys in Dry, MQL, and Flood Coolant Conditions,” The International Journal of Advanced Manufacturing Technology, published online, March 16, 2026. (https://doi.org/10.1007/s00170-026-17860-w)
  2. A. Singh, and A. Mian, "Additive Manufacturing Technologies for Electronic Integration and Packaging,” Electronic Materials, 7(1), 6, 2026. (https://doi.org/10.3390/electronicmat7010006)
  3. T. Alwattar, H. Abdulhadi, A. Al Yassari,  and A. Mian, "Additive Manufacturing of Glass Microfiber Reinforced Polymer Composites using Vat Polymerization,"  Journal of Elastomers and Plastics, 58(1), 2026. (https://doi.org/10.1177/009524432513830) 
  4. H. Abdulhadi, A. Fadeel, T. Alwattar, and A. Mian, "Developing Scalling Laws to Predict Compressive Mechanical Properties and Determine Geometrical Parameters of Modified BCC Lattice Cell Structures,” Engineering Reports, 5(2), e12566, 2023 (https://doi.org/10.1002/eng2.12566)
  5. A. Fadeel, H. Abdulhadi, R. Srinivasan, and A. Mian, "ABAQUS Plug-in Finite Element Tool for Designing and Analyzing Lattice Cell Structures,"  Advances in Engineering Software, vol. 169, paper # 103139, July 2022 (https://doi.org/10.1016/j.advengsoft.2022.103139)
  6. M. Al Rifaie, H. Abdulhadi, and A. Mian, "Advances in Mechanical Metamaterials for Vibration Isolation - A Review," Advances in Mechanical Engineering, vol. 14(3) 1-20, March 2022 (https://doi.org/10.1177/16878132221082872)
  7. A. Fadeel, H. Abdulhadi, G. Newaz, R. Srinivasan, and A. Mian, "Computational Investigation of the Post-Yielding Behavior of 3D Printed Polymer Lattice Structures,"  Journal of Computational Design and Engineering, vol. 9, issue 1, pp. 263-277, February 2022 (https://doi.org/10.1093/jcde/qwac001) 
  8. A. Fadeel, H. Abdulhadi, R. Srinivasan, and A. Mian, "A Computational Approach in Understanding the Low Velocity Impact Behavior and Damege of 3D Printed Polymer Lattice Structures,"  Journal of Materials Engineering and Performance, vol. 30, issue 8 AddManuf, Aug 2021 (https://doi.org/10.1007/s11665-021-05873-3) (Invited Paper)
  9. S. Patibandla, and A. Mian, "Layer-to-Layer Physical Characteristics and Compression Behavior of 3D Printed Polymer Metastructures Fabricated using Different Process Parameters," Journal of Elastomers and Plastics , vol. 53, issue 5, pp. 386-401, Aug 2021 (https://doi.org/10.1177/0095244320939995)
  10. A. Mian, A. Hamad, S. Longstreth, A. Archacki, R. Aga, C. Bartsch, and E. Heckman,  "The Effects of Printed Lattice Cell Structure Superstrates on Printed Patch Antennas,"  International Journal of RF and Microwave Computer-Aided Engineering, vol. 31, issue 6, June 2021, e22655 (https://doi.org/10.1002/mmce.22655)
  11. A. Hamad, A. Mian, and S. Khondaker, "Direct-Write Inkjet Printing of Nanosilver Ink (UTDAg) on PEEK Substrate,”  Journal of Manufacturing Processes, vol. 55, pp. 326-334, July 2020  (https://doi.org/10.1016/j.jmapro.2020.04.046).
  12. T. Alwattar, and A. Mian, "Developing an Equivalent Solid Material Model for BCC Lattice Cell Structures Involving Vertical and Horizontal Struts," Journal of Composites Science, 4(2), 74, June 2020 (https://doi.org/10.3390/jcs4020074).
  13. A. Hamad, A. Archacki, and A. Mian, “Characteristics of Nanosilver Ink (UTDAg) Microdroplets and Lines on Polyimide during Inkjet Printing at High Stage Velocity,” Materials Advances, issue 1, pp. 99-107, April 2020  (https://doi.org/10.1039/d0ma000048e).
  14. A. Hamad, M. Salam, and A. Mian, “Effect of Driving Waveform on Size and Velocity of Generated Droplets of Nanosilver Ink (Smartink),” Manufacturing Letters , vol. 24, pp. 14-18, April 2020 (https://doi.org/10.1016/j.mfglet.2020.03.001).
  15. M. Al Rifaie, A. Mian, P.  Katiyar, P. Majumdar, and R. Srinivasan, “Drop-Weight Impact Behavior of Three-Dimensional Printed Polymer Lattice Structures with Spatially Distributed Vertical Struts,” Journal of Dynamic Behavior of Materials, vol. 5, issue 4, pp. 387-395, Dec 2019 (https://rdcu.be/bFCUZ, https://doi.org/10.1007/s40870-019-00199-7).
  16. H. S. Abdulhadi, and A. Mian, “Effect of Strut Length and Orientation on Elastic Mechanical Response of Modified Body-Centered Cubic Lattice Structures,” Part L: Journal of Materials: Design and Applications, vol. 233, issue 11, pp. 2219-2233, Nov 2019 (https://doi.org/10.1177/1464420719841084).
  17. M. Al Rifaie, A. Mian,  and R. Srinivasan, “Compression Behavior of Three-Dimensional Printed Polymer Lattice Structures,” Part L: Journal of Materials: Design and Applications, vol. 233, issue 8, pp. 1574-1584, Aug 2019 (https://doi.org/10.1177/1464420718770475).
  18. S. Ahmed, and A. Mian, “Influence of Material Property Variation on Computationally Calculated Melt Pool Temperature during Laser Melting Process,” Metals , vol. 9, no. 4, 456, April 2019 (https://doi.org/10.3390/met9040456) (Invited Paper).
  19. T. Alwattar, and A. Mian, "Development of an Elastic Material Model for BCC Lattice Cell Structures using Finite Element Analysis and Neural Networks Approaches," Journal of Composites Science, vol. 3, no. 2, 33, April 2019 (https://doi.org/10.3390/jcs3020033).
  20. A. Hamad, and A. Mian, “Radio Frequency Response of Flexible Microstrip Patch Antennas under Compressive and Bending Loads using Multiphysics Modeling Approach,” International Journal of RF and Microwave Computer-Aided Engineering, vol. 29,  issue 3, March 2019, e21649 (https://doi.org/10.1002/mmce.21649).
  21. A. Fadeel, A. Mian, M. Al Rifaie, and R. Srinivasan, "Effect of Vertical Strut Arrangements on Compression Characteristics of 3D Printed Polymer Lattice Structures: Experimental and Computational Study," Journal of Materials Engineering and Performance , vol. 28, no. 2, pp. 709-716, February 2019 (https://doi.org/10.1007/s11665-018-3810-z) (Invited Paper)
  22. K. Rahman, R. Amin, and A. Mian, “A Numerical Study of Diffusion of Nanoparticles in a Viscous Medium During Solidification,” Journal of Thermal Science and Engineering Applications, vol 11, issue 1, February 2019 (https://doi.org/10.1115/1.4041349).
  23. M. Pinnell, S. Franco, L. Petry, A. Mian, B. Doudican, and R. Srinivasan, “Leveraging Regional Strengths for STEM Teacher Professional Development: Results from an NSF RET Program Focused on Advanced Manufacturing and Materials,” Research in the School, vol. 25, no. 1, pp. 20-34, Spring 2019.
  24. S. Keerthi, A. Hamad, A. Mian, J. Clifford, P. Majumdar, N. Chamok, and M. Ali,  “Effect of Heterogeneity in Additively Manufactured Dielectric Structures on RF Response of Microstrip Patch Antennas,” International Journal of RF and Microwave Computer-Aided Engineering, vol. 28, issue 4, May 2018 (http://rdcu.be/DveJ, https://doi.org/10.1002/mmce.21234).
  25. A. Turner, M. Al Rifaie, A. Mian, and R. Srinivasan, “Low-Velocity Impact Behavior of Sandwich Structures with Additively Manufactured Polymer Lattice Cores,” Journal of Materials Engineering and Performance, vol. 27, no. 5, pp. 2505-2512, May 2018 (https://rdcu.be/QvUv, https://doi.org/10.1007/s11665-018-3322-x).
  26. C. Kusuma, S. Ahmed, A. Mian, and R. Srinivasan, “Effect of Laser Power and Scan Speed on Melt Pool Characteristics of Commercially Pure Titanium (CP-Ti),” Journal of Materials Engineering and Performance, vol. 26, no. 7, pp. 3560-3568, July 2017 (http://rdcu.be/y8PF, https://doi.org/10.1007/s11665-017-2768-6).
  27. K. Rahim, and A. Mian, “A Review on Laser Processing in Electronic and MEMS Packaging,” Journal of Electronic Packaging, vol 139, no. 3, Sept. 2017 (https://doi.org/10.1115/1.4036239). (Invited Paper)
  28. V.S. Tummala, A. Mian, N. Chamok, D. Poduval, M. Ali, J. Clifford, P. Majumdar, “Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications,” Journal of Electronic Packaging, vol. 139, no. 2, June 2017 (https://doi.org/10.1115/1.4036384). (Invited Paper)
  29. A. Hossain, and A. Mian, “Four-Terminal Square Piezoresistive Sensors for MEMS Pressure Sensing,” Journal of Sensors, vol. 2017, article ID 6954875, January 2017 (https://doi.org/10.1155/2017/6954875).
  30. K. Joshi, A. Mian, and J. Miller, “Biomechanical Analysis of a Mechanosensory Hair Socket of Crickets,” Journal of Biomechanical Engineering, vol. 138, Aug. 2016, (https://doi.org/10.1115/1.4033915).
  31. A. Mian, C Taylor, and H. Vijwani, “Microstructural Analysis of Laser Micro-Welds between Copper and Aluminum,” Microsystems Technologies journal, vol. 22, pp. 261-267, 2016, (https://doi.org/10.1007/s00542-014-2385-3).
  32. A. Lambert, A. Mian, J. Hogan, T. Kaiser, and B. LaMeres, “Finite Element Analysis of System-Level Electronic Packages for Space Applications,” Journal of Computational Engineering, vol. 2015, article ID 428073, March 2015 (https://doi.org/10.1155/2015/428073).
  33. A. Hossain, A. Mishty, and A. Mian, “Numerical Analysis for Design Optimization of Microcantilever Beams for Measuring Rheological Properties of Viscous Fluid,” Finite Elements in Analysis and Design, vol. 68., pp. 1-9, June 2013 (https://doi.org/10.1016/j.finel.2013.01.002)
  34. M. Hailat, A. Mian, Z. Chaudhury, G. Newaz, R. Patwa, and H. Herfurth, “Laser micro-welding of aluminum and copper with and without tin foil alloy,” Microsystem Technologies, vol. 18, no. 1, pp. 103-112, January 2012 (https://doi.org/10.1007/s00542-011-1378-8).
  35. A. Hossain, L. Humphrey, and A. Mian, “Prediction of the Dynamic Response of a Mini-Cantilever Beam Partially Submerged in Viscous Media using Finite Element Method,” Finite Elements in Analysis and Design, vol. 48, no. 1, pp. 1339-1345, January 2012 (https://doi.org/10.1016/j.finel.2011.08.004). 
  36. R. Cassel, A. Mian, and T. Kaiser, “Design, Fabrication, and Testing of VDP MEMS Pressure Sensors,” Microsystem Technologies, vol. 17, no. 8, pp. 1301-1310, Aug 2011 (https://doi.org/10.1007/s00542-011-1307-x).
  37. A. Mian, J. Law, and G. Newaz, “Analysis of Laser Fabricated Microjoints Performance in Cerebrospinal Fluid using a Computational Approach,” Journal of the Mechanical Behavior of Biomedical Materials, vol. 4, no. 1, pp. 117-124, January 2011 (https://doi.org/10.1016/j.jmbbm.2010.09.013).
  38. A. Mian, and J. Law, “Geometric Optimization of van der Pauw Structure based MEMS Pressure Sensors,” Microsystem Technologies, vol. 16, no. 11, pp. 1921-1929, Nov 2010 (https://doi.org/10.1007/s00542-010-1124-7).
  39. A. Mian, and J. Law, “Computational Investigation of van der Pauw Structures for MEMS Pressure Sensors,” Computational Materials Science, vol. 49 no. 3, pp. 652–662, Sept 2010 (https://doi.org/10.1016/j.commatsci.2010.06.008).
  40. A. Mian, T. Sultana, D. Georgiev, R. Witte, H. Herfurth G. Auner, and G. Newaz, “Post-Implantation Pressure Testing and Characterization of Glass/Polyimide Microjoints,” Journal of Biomedical Materials Research B; vol. 90B no. 2, pp. 614 – 620, Apr 2009 (https://doi.org/10.1002/jbm.b.31325).
  41. C. Cho, R.C. Jaeger, J.C. Suhling, Y. Kang, and A. Mian, “Characterization of the Temperature Dependence of the Pressure Coefficients of n- and p-type Silicon Using Hydrostatic Testing,” IEEE Sensors Journal, vol. 8, no. 4, April 2008 (https://doi.org/10.1109/JSEN.2008.917491).
  42. A. Mian, G. Newaz, T. Mahmood, G. Auner, R. Witte, and H. Herfurth, “Mechanical Characterization of Glass/Polyimide Microjoints Fabricated using cw Fiber and Diode Lasers,”Journal of Materials Science, vol. 42, no. 19, pp. 8150–8157, October 2007 (https://doi.org/10.1007/s10853-007-1703-x).
  43. A. Mian, T. Sultana, G. Auner, and G. Newaz, “Bonding Mechanisms of Laser Fabricated Titanium/Polyimide and Titanium Coated Glass/Polyimide Microjoints,” Surface and Interface Analysis, vol. 39, Issue 6, pp. 506-511, June 2007 (https://doi.org/10.1002/sia.2547).
  44. T. Mahmood, A. Mian, M. Amin, G. Auner, R. Witte, and H. Herfurth, G. Newaz, “Finite Element Modeling of Transmission Laser Microjoining Process,” Journal of Materials Processing Technology, vol. 186, no. 1-3, pp. 37–44, May 2007 (https://doi.org/10.1016/j.jmatprotec.2006.11.225).
  45. A. Mian, G. Newaz, D. Georgiev, N. Rahman, J. Vendra, G. Auner, R. Witte, and H. Herfurth, “Performance of Laser Bonded Glass/Polyimide Microjoints in Cerebrospinal Fluid,” Journal of Materials Science: Materials in Medicine, vol. 18, no. 3, pp. 417-427, March 2007 (https://doi.org/10.1007/s10856-007-2000-6).
  46. G. Newaz, A. Mian, T. Sultana, T. Mahmood, D. Georgiev, R. Witte, H. Herfurth, and G. Auner, “A Comparison between Glass/Polyimide and Titanium/Polyimide Microjoint Performances in Cerebrospinal Fluid,” Journal of Biomedical Materials Research A, vol. 79A, issue 1, pp. 159-165, October 2006 (https://doi.org/10.1002/jbm.a.30709).
  47. M. Mayeed, A. Mian, G. Auner, and G. Newaz, “Accumulation of E. Coli Bacteria in Mini-Channel Flow,” Journal of Biomechanical Engineering, Vol. 128, pp. 458-461, June 2006 (https://doi.org/10.1115/1.2187049).
  48. A. Mian, J. Suhling, and R. Jaeger, “The van der Pauw Stress Sensor,” IEEE Sensors Journal, vol. 6, issue 2, pp. 340 - 356, April 2006 (https://doi.org/10.1109/JSEN.2006.870140).
  49. D. Georgiev, T. Sultana, A. Mian, G. Auner, R. Witte, H. Herfurth, and G. Newaz, “Laser Fabrication and Characterization of Sub-Millimeter Joints between Polyimide and Ti-coated Borosilicate Glass,” Journal of Materials Science, 40 (2005) 5641–5647 (https://doi.org/10.1007/s10853-005-1291-6).
  50. A. Mian, G. Newaz, J. Vendra, N. Rahman, D. Georgiev, G. Auner, R. Witte, and H. Herfurth, “Laser Bonded Microjoints between Titanium and Polyimide for Applications in Medical Implants,” Journal of Materials Science: Materials in Medicine, vol. 16, no. 3, pp. 229 – 237, 2005 (https://doi.org/10.1007/s10856-005-6684-1).
  51. A. Mian, G. Newaz, X. Han, and C. Saha, “Response of Subsurface Fatigue Damage under Sonic Load – A Computational Study,” Composites Science and Technology, vol. 64 no. 9, pp 1115-1122, 2004 (https://doi.org/10.1016/j.compscitech.2003.08.009).
  52. A. Mian, X. Han, S. Islam, and G. Newaz, “Fatigue Damage Detection In Graphite/Epoxy Composites Using Sonic Infrared Imaging Technique,” Composites Science and Technology, vol. 64 no. 5, pp 657-666, 2004 (https://doi.org/10.1016/j.compscitech.2003.07.005).
  53. Y. Zou, J. Suhling, W. Johnson, R. Jaeger, and A. Mian, “In-Situ Stress State Measurements During Chip-on-Board Assembly,” IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, No. 1, January 1999 pp. 38-52 (https://doi.org/10.1109/6104.755088).
  54. H. Mahfuz, A. Mian, Vaidya, U., Brown, T., and Jeelani, S., “Finite Element Study of the Fiber-Matrix Interface Behavior of [0o/90o] Laminated Composites Under Tensile Loading, “Journal of Materials Science, 33(1998), pp. 2965-2973 (https://doi.org/10.1023/A:1004358814805).
  55. A. Mian, and I. Hossain, "Natural Convection Heat Transfer from an Inclined Isothermal Cylinder," Journal of Mechanical Engineering Research and Development, vol. 16, December 1993, pp. 13-25. 

Book Chapter

T. Alwattar, and A. Mian, “Developing an Equivalent Solid Material Model for BCC Lattice Cell Structures Involving Vertical and Horizontal Struts,” in Characterization and Modelling of Composites, Stelios K. Georgantzinos (Ed.), MDPI, ISBN 978-3-0365-0714-9


S. Khan, A. Mian, and G. Newaz, “Thin Film Coating as Electrodes in Neuroscience,” in Thin Films and Coating in Biology, Saroush Nazarpour (Ed.), Springer Publications, 2014 (ISBN 978-94-007-2592-8).

Conference Proceedings 

1.      N. Sepelak, M. J. Harrington, W. Wang, A. Srikanth, T. Prusnick, S. Nikodemski, K. Leedy, B. Sarkar, K. Liddy, B. Bussey, A. Mian, A. Green, and A. Islam, “Survivability of AlGaN/GaN HEMTs made with WNx- and Pt-based Gate Metal Stacks above 500 oC,” IMAPSource Proceedings 2025(HiTEC, CICMT, Power), 447–63, January 2026. (https://doi.org/10.4071/001c.155892).    

  1. L. Clark, F. Ouchen, L. Davidson, O. Ranasingha, E. Heckman, C. Bartsch, and A. Mian, “Gamma Radiation Attenuation of Additively Manufactured Polymers,” 2025 ASME International Mechanical Engineering Congress & Exposition, Memphis, TN, November 2025. (https://doi.org/10.1115/IMECE2025-161492)
  2. V. Asam, S. Ahsan, R. Srinivasan, D. Young, and A. Mian, “A Finite Element Approach to Understanding the Effect of 3D Printed Preform Shapes on Strain Distribution During Hot Forging,” 2025 MS&T Conference Proceeding, Columbus, OH, September 2025.
  3. S. Ahsan, V. Asam, R. Srinivasan, A. Mian, and D. Young, “Effect of Size and Shape Parameters on the Mechanical and Material Properties of Additively Manufactured Inconel 718,” 2025 ASME International Mechanical Engineering Congress & Exposition, Memphis, TN, November 2025. (https://doi.org/10.1115/IMECE2025-166144)
  4. B. Munyurwe, R. Aga, C. Bartsch, and A. Mian, “Reliability Assessment of Aerosol Jet Printed Electrical Interconnects for Heterogeneous Integration,” 2025 ASME International Mechanical Engineering Congress & Exposition, Memphis, TN, November 2025. (https://doi.org/10.1115/IMECE2025-163538)
  5. A. Singh, and A. Mian, “Formulation and Characterization of Nanosilver and Nanocomposite Dielectric Inks for Inkjet-Printed Electronic Integration and Packaging,” 2025 ASME International Mechanical Engineering Congress & Exposition, Memphis, TN, November 2025. (https://doi.org/10.1115/IMECE2025-166242)
  6. L. Clark, F. Ouchen, L. Davidson, O. Ranasingha, E. Heckman, C. Bartsch, and A. Mian, “Exposure of Aerosol Jet Printed h-BN/Polyimide Nanocomposite Films to Gamma Radiation,” 2025 TMS Annual Meeting and Exhibition, Las Vegas, NV.
  7. A. Singh and A. Mian, “Processing and Characterization of Functional Ink Materials for Flexible Hybrid Electronics,” 2025 1st International Conference on Secure IoT, Assured and Trusted Computing (SATC), Dayton, OH, 25-27 February 2025. (https://10.1109/SATC65530.2025.11137182)
  8. L. Clak, F. Ouchen, T. Taylor, E. Heckman, C. Bartsch, and A. Mian, “Direct Ink Write Processing of Signal Crossovers Using Aerosol Jet Printing Method,” 2023 IEEE National Aerospace and Electronics Conference (NAECON), Fairborn, OH, Aug 2023. (https://doi.org/10.1109/NAECON58068.2023.10365897). 
  9. W. Metzger, L. Davidson, F. Ouchen, R. Aga, T. Pandhi, C. Bartsch, E. Heckman, and A. Mian, “Characterization of Printed Silver Thin Films Sintered by a Scanning Laser,” 2023 IEEE National Aerospace and Electronics Conference (NAECON), Fairborn, OH, Aug 2023. (https://doi.org/10.1109/NAECON58068.2023.10510377)
  10. F. Ouchen, L. Davidson, A. Mian, L. Clark, E. Heckman, and J. Massman, “Direct Write Processing of Low Loss Polymeric Dielectrics for Heterogeneous Integration,” GOMACTech Conference, San Diego, CA, March 2023.
  11. A. Mian, M. Pinnell, S. Franco, L. Petry, B. Doudican, and R. Srinivasan, “Lesson Learned from a Collaborative NSF RET Program involving Three Regional Universities,” ASEE Annual Conference and Exposition, Salt Lake City, UT, June 2018.
  12. Kazi M. Rahman, Ruhul Amin, and Ahsan Mian, “A Numerical Study of Diffusion of Nanoparticles in a Viscous Medium during Solidification,” 2017 ASME International Mechanical Engineering Congress & Exposition, Tampa, FL, November 2017.
  13. Benjamin Lewis, Jonah Leary, Cynthia Dickman, Walter Petroski, Victoria Bellows, Abbie Morneault, Amanda Bucher, Diondra Copeland, Ahsan Mian, and Raghavan Srinivasan, “The NSF REU/RET Research on Energy Absorbing 3D Printed Polymer Structures,” 2017 ASME International Mechanical Engineering Congress & Exposition, Tampa, FL, November 2017.
  14. L. Petry, M. Pinnell, S. Franco, B. Doudican, A. Mian, and R. Srinivasan, “Collaborative Community-based Research Experience in Materials and Manufacturing,” ASEE Annual Conference and Exposition, Cincinnati, OH, June 2017.
  15. V.S. Tummala, A. Mian, N. Chamok, M. Ali, J. Clifford, P. Majumdar, “3D Printed Porous Dielectric Substrates for RF Applications,” 2016 ASME International Mechanical Engineering Congress & Exposition, Phoenix, AZ, November 2016. [RECEIVED BEST PAPER AWARD]
  16. A. Mian, M. Pinnell, L. Petry, R. Srinivasan, S. Franco, M. Taylor, and S. Preiss, “Summer Research and Collaborative Professional Development Experience for NSF RET Teachers in Advanced Materials and Manufacturing,” 2016 ASME International Mechanical Engineering Congress & Exposition, Phoenix, AZ, November 2016.
  17. A. Hossain, and A. Mian, “Sensitivity Analysis of a Planar Piezoresistive Sensors for MEMS Applications,” 2016 ASME International Mechanical Engineering Congress & Exposition, Phoenix, AZ, November 2016.
  18. M. Pinnell, M. Taylor, L. Petry, R. Srinivasan, S. Franco, A. Mian, and S. Preiss, “Assessment of a Collaborative NSF RET Program Focused on Advanced Manufacturing and Materials,” ASEE Annual Conference and Exposition, New Orleans, LS, June 2016
  19. S. Ahmed, A. Mian, and R. Srinivasan, “Effects of Process Parameters on Hardness, Hardness and Solidification Rate of Different Layers Processed Using Direct Metal Laser Sintering (DMLS),” 11th International Conference on Mechanical Engineering, ICME 2015, Dhaka, Bangladesh, December 2015.
  20. A. Hossain, and A. Mian, “Dynamic Analysis of a Microscale Cricket Filiform Hair Socket,” 2015 ASME International Mechanical Engineering Congress & Exposition, Houston, TX, November 2015.
  21. S. Ahmed, H. Doak, A. Mian, and R. Srinivasan, “Influence of Process Parameters on the Mechanical Response of Various Layers Processed Using Direct Metal Laser Sintering (DMLS),” 2014 ASME International Mechanical Engineering Congress & Exposition, Montreal, Canada, November 2014.
  22. A. Hossain, and A. Mian, “Factors Affecting Spherical Nano-Indentaton of Thin Film/Substrate System,” 2014 ASME International Mechanical Engineering Congress & Exposition, Montreal, Canada, November 2014.
  23. A. Hossain, and A. Mian, “Static Analysis of a Microscale Cricket Filiform Hair Socket,” 2014 ASME International Mechanical Engineering Congress & Exposition, Montreal, Canada, November 2014.
  24. M. Rahman, B. Calloway, and A. Mian, “Finite Element Analysis of a Hobie 16 Mast and Possible Alternatives,” 2014 ASME International Mechanical Engineering Congress & Exposition, Montreal, Canada, November 2014.
  25. A. Hossain and A. Mian, “Nano-Indentation for Characterizing Mechanical Properties of Biofilm,” 2013 ASME International Mechanical Engineering Congress & Exposition, San Diego, CA, November 2013.
  26. A. Mian, C. Taylor, S. Mukhopadhyay, K. Hartke, and L. Dosser, “Microstructural Analysis of Laser Microwelds between Electrode Materials for Li-Ion Battery Applications,” 2013 ASME International Mechanical Engineering Congress & Exposition, San Diego, CA, November 2013.
  27. A. Hossain and A. Mian, “Characterize Dynamic Response of Cantilevers for Measuring Properties of Viscous Fluids,” ASME International Mechancial Engineering Congress and Exposition Proceedings (IMECE), Houston, TX, v 9, Parts A&B, p. 19-24, 2012, ASME 2012 International Mechanical Engineering Congress and Exposition, IMECE 2012.
  28. K. Joshi, A. Mian, and J. Miller “Model Development and Analysis of a Cricket Filiform Hair Socket under Low Velocity Air Currents,” ASME International Mechancial Engineering Congress and Exposition Proceedings (IMECE), Houston, TX, v 9, Parts A&B, p. 13-18, 2012, ASME 2012 International Mechanical Engineering Congress and Exposition, IMECE 2012.
  29. B. LaMeres, A. Mian, H. Lloyd, and R. Larson, "The Montana MULE: A Case Study in Interdisciplinary Capstone Design," ASEE Annual Conference and Exposition, Conference Proceedings, 2011, 118th ASEE Annual Conference and Exposition. [RECEIVED BEST PAPER AWARD]
  30. A. Hossain and A. Mian, “Numerical Analysis to Predict Dynamic Response of Mini Cantilever Beam Partially Submerged in Viscous Fluids,” ASME International Mechancial Engineering Congress and Exposition Proceedings (IMECE), v 11, p. 1-6, 2011, ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011.
  31. Mishty, and P. Stewart, and A. Mian, “Dynamic Response of Mini-Cantilever Beams in Viscous Media,” ASME International Mechancial Engineering Congress and Exposition Proceedings (IMECE), Vancouver, BC, v 10, p. 71-74, 2010, ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010.
  32. A. Mian, M. Hailat, G. Newaz, R. Patwa, and H. Herfurth, “Characterization of Laser Processed Sub-Millimeter Lap Joints Between Copper And Aluminum Under Tensile Load,” ASME International Mechancial Engineering Congress and Exposition Proceedings (IMECE), Vancouver, BC, v 10, p. 71-74, 2010, ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010.
  33. M. Rahman, K. Morshed, and A. Mian, “Aerodynamic Performance Analysis of Three Bladed Savonius Wind Turbine with Different Overlap Ratios and at various Reynolds Number,” ASME International Mechancial Engineering and Exposition Proceedings (IMECE), Vancouver, BC, v 5, Parts A&B, p. 1209-1219, 2010, ASME 2010 International Mechanical Engineering Congress and Exposition, IMECE 2010.
  34. R. Cassel, A. Mishty, and A. Mian, “High Sensitivity Pressure Measurement using van der Pauw Structure as a Sensing Element,” ASME International Mechanical Engineering Congress and Exposition Proceedings (IMECE), Lake Buena Vista, FL, v 12, Part A, p. 39-44 , 2010, 2009 Proceedings of ASME International Mechanical Engineering Congress and Exposition, IMECE 2009.
  35. R. Cassel, and A. Mian, “Design, Fabrication, and Testing of van der Pauw Structure for MEMS Pressure Testing,” ASME International Mechanical Engineering Congress and Exposition Proceedings (IMECE), Boston, MA, v 13, Part A, p. 97-102, 2009, 2008 Proceedings of ASME International Mechanical Engineering Congress and Exposition, IMECE 2008.
  36. A. Mian, T. Sultana, and G. Newaz, “Performance of Laser Microjoints in Rat Brain,” ASME International Mechanical Engineering Congress and Exposition Proceedings (IMECE), Boston, MA, v 6, p. 191-195, 2009, 2008 Proceedings of ASME International Mechanical Engineering Congress and Exposition, IMECE 2008.
  37. R. Cassel, R. Pierce, J. Glenn, C. Yirsa, and A. Mian, “Design, Fabrication and Testing of a MEMS Pressure Sensor Calibration Setup,” 2008 IEEE/EDS Workshop on Microelectronics and Electron Devices (WMED-2008), Boise, Idaho
  38. J. Law, R. Cassel, and A. Mian, “Geometric Optimization of VDP based MEMS pressure sensor,” 2007 ASME International Mechanical Engineering Congress & Exposition, Seattle, WA, November 2007.
  39. A. Mian, and J. Law, “Finite Element Analysis of Laser Fabricated Microjoint Performance in Cerebrospinal Fluid,” InterPACK 07, Vancouver, B.C., July 8 – 12, 2007
  40. J. Law, and A. Mian, “A VDP Based MEMS Pressure Sensor,” 2007 IEEE/EDS Workshop on Microelectronics and Electron Devices (WMED-2007), April 2007, Boise, Idaho.
  41. A. Mian, and J. Law, “A High Sensitivity Piezoresistive Pressure Sensor,” International Conference on Integration and Commercialization of Micro and Nano-Systems, January 10-17, 2007, Sanya, China.
  42. A. Mian, T. Mahmood, M. R. Amin, and G. Newaz, “Characterization of Laser Microjoining Process Using a Computation Technique,” Proceedings of the 3rd BSME-ASME International Conference on Thermal Engineering, Dhaka, Bangladesh, 20-22 December 2006.
  43. A. Mian, J. Law, and G. Newaz, “Performance of Laser Bonded Microjoints between Titanium and Polyimide in Cerebrospinal Fluid,” 2006 Summer Bioengineering Conference, June 21 - 25, 2006, Amelia Island Plantation, Amelia Island, FL
  44. A. Mian, T. Mahmood, D.G. Georgiev, and G. Auner, G. Newaz, R. Witte, and H. Herfurth, “Effects of Laser Parameters on the Laser Irradiated Micro-Joints for Bioencapsulation,”2006 MRS Spring Meeting, April 17-21, 2006, San Francisco, CA
  45. A. Mian, J. C. Suhling, and R. C. Jaeger, “A High Sensitive Piezoresistive Sensor for Stress Measurements in Packaged Semiconductor Die,” 2006 IEEE/EDS Workshop on Microelectronics and Electron Devices (WMED-2006), April 14, 2006, Boise, Idaho
  46. G. Newaz, D. Georgiev, A. Mian, G. Auner, R. Witte, H. Herfurth, “Laser Fabrication and Characterization of Adhesive-Free Joints For Encapsulation of Biomedical Implant Devices,”Proceedings of the MRS Fall Meetings, 29 Nov – 3 Dec, 2004, Boston, MA.
  47. H. Herfurth, R. Witte, S. Heinemann, G. Newaz, A. Mian, D. Georgiev, and G. Auner, “Joining Challenges in the Packaging of BioMEMS,” Proceedings of the 23rd International Congress on Applications of Lasers and Electro-Optics (ICALEO 2004), 4-7 October 2004, San Francisco, California.
  48. N. Rahman, A. Mian, G. Newaz, “Analysis and characterization of adhesively bonded Mg-Steel lap joint,” Proceedings of the ASME International Mechanical Engineering Congress, Anaheim, California, November 13-19, 2004.
  49. A. Mian, G. Newaz, T. Mahmood, and H. Mahfuz, “High Strain Rate Behavior of Partially Fatigued Nanocomposites,” Developments in Theoretical and Applied Mechanics, 22nd Southeastern Conference on Theoretical and Applied Mechanics (SECTAM XXII), August 15-17, 2004, Tuskegee, AL, vol. XXII, pp. 108-114.
  50. A. Mian, G. Newaz, L. Vendra, X. Wu, and S. Liu,“Role of Defects on Mechanical Behavior of Nafion Membranes for Fuel Cell Applications,” 2nd International Conference on Fuel Cell Science, Engineering, and Technology, Rochester, NY, June 2004, pp. 607-611.
  51. I. Bauer, U.A. Russek, H. Herfurth, R. Witte, S. Heinemann, G. Newaz, A. Mian, D. Georgiev, and G. Auner, “Laser micro-joining of dissimilar and biocompatible materials,” Proceedings of SPIE - Photonics West LASE 2004: Lasers and Applications in Science and Engineering conference, 24-29 January 2004, San Jose, California, vol. 5339, p. 454.
  52. G. Newaz, A. Mian, L. Vendra, D. Georgiev, T. Mahmood, G. Auner, R. Witte, and H. Herfurth, “Mechanical Characterization of Laser Microjoints for Bioencapsulation,” Proceedings of the International Congress on Materials Science and Nanotechnologies, European Academy of Science, Brussels, Belgium, October 2003.
  53. X. Han, A. Mian, and G. Newaz, “Fatigue Damage Evaluation in Composite Materials Using Thermosonics Technique,” Proceedings of the International Congress on Composite Materials (ICCM-14), June 2003.
  54. J. Suhling, R. Johnson, A.K.M. Mian, M. Rahim, Y. Zou, C. Ellis, S. Ragam, M. Palmar, and R. Jaeger, "Measurement of Backside Flip Chip Die Stresses using Piezoresistive Test Die,"32ndInternational Symposium on Microelectronics, IMAPS 1999, Chicago, October 26-28, 1999. [RECEIVED BEST PAPER AWARD]
  55. A. Mian, J. Suhling, and R. Jaeger, "Sensitivity of (100) Silicon van der Pauw Sensors to Uniaxial and Hydrostatic Loads,” SECTAM XX, SM-126, April 2000, pp.1-9.
  56. A.K.M. Mian, J. Suhling, and R. Jaeger, "Sensitivity of van der Pauw Stress Sensors to Uniaxial Stress," Proceedings of Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference (InterPACK '99), Advances in Electronic Packaging 1999, EEP-Vol. 26-1, pp. 195-203, Maui, HI, June 13-19, 1999.
  57. A.K.M. Mian, J. Suhling, and R. Jaeger, "Theoretical and Experimental Analysis of VDP Sensors for Use in Die Stress Measurements," Proceedings of the SEM Annual Conference on Theoretical, Experimental and Computational Mechanics, pp. 76-80, Cincinnati, OH, June 7-9, 1999.
  58. A.K.M. Mian, J. Suhling, and R. Jaeger, “Theoretical and Experimental Study of the Piezoresistive Behavior of van der Pauw Sensors,” TECHCON Conference, Las Vegas, Nevada, September 9-11, 1998.
  59. J. Suhling, R. Jaeger, A. Bradley, and A.K.M. Mian, “FET and VDP Stress Sensors for Experimental Characterization of Die Stress in Electronic Packages”, Proceedings of 1998 Spring Conference on Experimental & Applied Mechanics, pp. 232-234, Houston, TX, June 1-3, 1998.
  60. A.K.M. Mian, J. Suhling, R. Jaeger, and B. Wilamowski, “Evaluation of Die Stress Using van der Pauw Sensors,” Proceedings of 1997 ASME International Mechanical Engineering Congress and Exposition, Applications of Experimental Mechanics to Electronic Packaging 1997, Dallas, TX, Nov. 16-21, 1997, EEP-Vol. 22, AMD-Vol. 226, pp. 59-67.
  61. Y. Kang, A.K.M. Mian, J. Suhling, and R. Jaeger, “Hydrostatic Response of Piezoresistive Stress Sensors,” Proceedings of 1997 ASME International Mechanical Engineering Congress and Exposition, Applications of Experimental Mechanics to Electronic Packaging 1997, Dallas, TX, Nov. 16-21, 1997, EEP-Vol. 22, AMD-Vol. 226, pp. 29-36.
  62. J. Suhling, R. Jaeger, S. Lin, A. Mian, R. Cordes, and B. Wilamowski, “Design and Calibration of Optimized (111) Silicon Stress Sensing Test Chips,” Proceedings of INTERpack ’97, pp. 1723-1729, Kohala, HI, June 15-19, 1997.
  63. A.K.M. Mian, R. Cordes, B. Wilamowski, S. Lin, J. Suhling, and R. Jaeger, “Design, Calibration, and Application of Optimized (111) Silicon Stress Sensing Test Chips,” TECHCON Conference, Arizona, Sept. 12, 1996.
  64. H. Mahfuz, A.K.M. Mian, S. Jeelani, U. Vaidya, and T. Brown, "Study of the Interface Behavior of SiCf/Si3N4 Composites Using a 3-D Unit Cell Model,” Proceedings of the 4th International Symposium on Advanced Materials, Islamabad, Pakistan, 17-21 Sept., 1995, pp. 667-677.
  65. A.K.M. Mian, and H. Mahfuz, “Effects of Thermally Induced Residual Stress on the Fiber-Matrix Interface Failure of 0/90 Laminated Composites- A Finite Element Study,” Proceedings of the 1995 Student Paper Competition of the SEM Spring Conference and Exhibits, June 12, 1995, pp. 13-14.
  66. H. Mahfuz, A. Mian, U. Vaidya, T. Brown, and S. Jeelani, "Prediction of Fiber-Matrix Interface Failure Due to Longitudinal Tensile Loading using Finite Element Methods, “Materials Research Society Symposium, vol. 365, 1995, pp. 229-236.

Presentation only

  1. S. Ahsan, V. Asam, R. Srinivasan, A. Mian, and D. Young, “Utilizing Additive Manufacturing Techniques for Preforms in the Forging Metal Process,” 2025 MS&T Conference, Columbus, OH, September 2025.
  2. L. Clark, F. Ouchen, L. Davidson, O. Ranasingha, E. Heckman, C. Bartsch, and A. Mian, “Gamma Ray Shielding Performance of 3D Printed Polymers,” 2025 MS&T Conference, Columbus, OH, September 2025.
  3. A. Singh, and A. Mian, “Exploring Functional Ink materials and Process Evaluation of High-Precision Additive Manufacturing Inkjet Technique,” 2025 MS&T Conference, Columbus, OH, September 2025.
  4. A. Adeyemi, V. Subramanian, T. Kanit, and A. Mian, “Effect of Build Orientation and Environmental Conditions on Mechanical Properties, Dimensional Accuracy, and Surface Characteristics of Polyamide 12 Parts Fabricated Using Powder Bed Fusion Additive Manufacturing Process,” 2025 ASME International Mechanical Engineering Congress & Exposition, Memphis, TN, November 2025.
  5. M. Hallaet, A. Ammar, T. Kanit, and A. Mian, “Machine Learning-Driven Optimization of FDM Process Parameters for 3D Printing of PLA,” 2025 ASME International Mechanical Engineering Congress & Exposition, Memphis, TN, November 2025.
  6. V. Asam, S. Ahsan, R. Srinivasan, D. Young, and A. Mian, “Designing Optimized Preforms Using Computational Techniques for Additive Manufacturing-Assisted Forging,” 2025 ASME International Mechanical Engineering Congress & Exposition, Memphis, TN, November 2025.
  7. L. Clark, F. Ouchen, E. Heckman, C. Bartsch, and A. Mian, “Aerosol Jet Printing and Characterization of Polyimide and hBN/polyimide Nanocomposite Thin Films,” 2024 ASME International Mechanical Engineering Congress & Exposition, Portland, OR, November 2024.
  8. R. Aga, L. Duncan, A. Mian, and C. Bartsch, “Packaging of a Temperature Sensor Bare Die Inside a Metal-Infused PCB Cavity,” 2024 ASME International Mechanical Engineering Congress & Exposition, Portland, OR, November 2024.
  9. L. Duncan, R. Aga, C. Bartsch, E. Heckman, and A. Mian, “Mechanical Reliability of Strain Sensors Printed Using Additive/subtractive Hybrid Fabrication Method,” 2023 ASME International Mechanical Engineering Congress & Exposition, New Orleans, LA, November 2023.
  10. A. Hossain, and A. Mian, “Design Optimization of Piezoresistive Pressure Sensors for Mems Applications,” 2023 ASME International Mechanical Engineering Congress & Exposition, New Orleans, LA, November 2023.
  11. M. Muhammad, H. Huang, and A. Mian, "Inkjet Printed Ceramic/Polymer Nanocomposite Dielectrics," Nano + Additive Manufacturing Summit, Luiseville, KY, July 2023
  12. M. Muhammad, H. Huang, and A. Mian, "Inkjet Printed Ceramic/Polymer Composite Dielectric," 2022 ASME International Mechanical Engineering Congress & Exposition, Columbus, Ohio, November 2022
  13. H. Ajose, A. Mian, and H. Huang, "Fabrication of Miniature and Interdigital Li-Ion Batteries via Drop-on-Demand Inkjet Printing,"2022 ASME International Mechanical Engineering Congress & Exposition, Columbus, Ohio, November 2022
  14. I. Ekpelu, and A. Mian, “3D Printed Surface Surface Based Lattice Structures for Vibration Attenuation,” 2022 ASME International Mechanical Engineering Congress & Exposition, Columbus, Ohio, November 2022
  15. J. Jeiffer, A. Fadeel, A. Palazotto, and A. Mian, “Finite Element Modeling and Experimental Validation of 3D Printed Polymeric Trply Periodic Minimal Surface (TPMS) Cellular Structures under Low Velocity Impact Loads,” 2022 ASME International Mechanical Engineering Congress & Exposition, Columbus, Ohio, November 2022
  16. A. Fadeel, and A. Mian, “Experimental and Computational Investigation of the Post-Yielding Behavior of 3D Printed Polymer Lattice Structures,” 2020 ASME International Mechanical Engineering Congress & Exposition, November 2020
  17. A. Hamad, and A. Mian, “Effect of High Stage Velocity and Sintering Temperature on Inkjet Printed Nanosilver (UTDAg) Conductors on Polyimide,” 2020 ASME International Mechanical Engineering Congress & Exposition, November 2020
  18. A. Hamad, and A. Mian, “Additively Manufactured Embedded Electronics,” 2019 ASME International Mechanical Engineering Congress & Exposition, Salt Lake City, UT, November 2019
  19. A. Hamad, and A. Mian, “Direct inkjet printing of nanosilver ink on flexible and rigid substrates,” 2019 ASME International Mechanical Engineering Congress & Exposition, Salt Lake City, UT, November 2019
  20. T. Alwattar, and A. Mian, “Developing a Surrogate model to Predict the mechanical characteristics of generated lattice design structure,” ASME International Mechanical Engineering Congress & Exposition (IMECE) ASME, Salt Lake City, UT, November 2019.
  21. H. Abdulhadi, and A. Mian, “Designing Lattice Structures Based on Scaling Laws Using Finite Element Analyses,” International Mechanical Engineering Congress & Exposition (IMECE) ASME, Salt Lake City, UT, November 2019.
  22. H. Abdulhadi, and A. Mian, “The Influence of the Micro-structure Parameters on the Elastic Response of BCC Lattice Structures,” The 44th Dayton-Cincinnati Aerospace Sciences Symposium (DCASS), Dayton, Ohio, March 5, 2019.
  23. H. Abdulhadi, and A. Mian, “Investigating the Elastic Tensile and Shear Performance of BCC Lattice Structures Based on Strut Size and Inclination,” The 44th Dayton-Cincinnati Aerospace Sciences Symposium (DCASS), Dayton, Ohio, March 5, 2019.
  24. T. Alwattar, and A. Mian, “Deterministic Mechanical Properties in Designing Miscellaneous Lattice Cell Structures Using Kriging Model,” The 44th Dayton-Cincinnati Aerospace Sciences Symposium (DCASS), Dayton, Ohio, March 5, 2019.
  25. A. Fadeel, A. Mian, “Impact behavior of 3D printed polymer lattice structure: Experimental and Finite Element Study,” American institute of Aeronautics and Astronautics, Dayton-Cincinnati, March 5, 2019
  26. H. Abdulhadi, and A. Mian, “Influence of Weight and Strut Angle on the Elastic Mechanical Response of 3D Printed Polymer Lattice Structure,” The 14th Dayton Engineering Sciences Symposium (DESS), Dayton, Ohio, October 30, 2018. [RECEIVED BEST PRESENTATION AWARD]
  27. Alwattar, and A. Mian, “Equivalent Material Model for Lattice Cell Structures Using Numerical Approaches,” The 14th Dayton Engineering Sciences Symposium (DESS), Dayton, Ohio, October 30, 2018.
  28. A. Hamad, S. Keerthi, A. Mian, and M. Ali, “Dielectric Characteristics of 3D Printed Heterogeneous Structures,” 2017 ASME International Mechanical Engineering Congress & Exposition, Tampa, FL, November 2017.
  29. A. Hossain, and A. Mian, “Response of a Filiform Hair-Socket Assembly of Crickets under Pulsating Loads,” 2016 ASME International Mechanical Engineering Congress & Exposition, Phoenix, AZ, November 2016.
  30. A. Mian, N. Blair and A. Hossain, “Effects of Pad Size and Fabrication Errors on the Stress Sensitivity of Two Dimensional Piezoresistive Sensors,” 2015 ASME International Mechanical Engineering Congress & Exposition, Houston, TX, November 2015.
  31. A. Hossain and A. Mian, “Understanding Deformation Mechanism of a Microscale Cricket Filiform Hair Socket,” 2013 ASME International Mechanical Engineering Congress & Exposition, San Diego, CA, November 2013.
  32. A. Rashid, A. Mian, and A. Hossain, “Factors affecting Spherical Indentation Technique for Measuring Mechanical Properties of Biofilm,” 2012 ASME International Mechanical Engineering Congress & Exposition, Houston, TX, November 2012
  33. A. Hossain, and A. Mian, “Design Optimization of Microcantilever Beams for Measuring Rheological Properties of Viscous Fluid,” 2011 ASME International Mechanical Engineering Congress & Exposition, Denver, CO, November 2011
  34. A. Mian, and G. Newaz, “Thermal Wave Imaging and Bond Strength Measurements of Laser Fabricated Microjoints Between Dissimilar Materials,”2009 ASME International Mechanical Engineering Congress & Exposition, Lake Buena Vista, FL, November 2009.
  35. G. Newaz, A. Mian, X. Han, L. Favro, and R. Thomas, “Advances in Sonic IR Imaging for Crack Detection,”ASME International Mechanical Engineers Congress (IMEC), Washington DC, Nov. 2003.
  36. A.K.M. Mian, “Complete Stress-State Sensing Using a (111) Silicon Test Chip,” Southeastern Symposium on Experimental Mechanics, Gainesville, FL, March 14-15, 1997.
  37. A.K.M. Mian, “Complete Calibration of Stress Sensing Test Chips,” 1996 Southeastern Symposium on Experimental Mechanics, Tuskegee, Alabama, March 29-30, 1996.
  38. H. Mahfuz, A. Mian, B. Gama, and S. Jeelani, “Experimental and Finite Element Study of the Static Compression and Reversed Fatigue Behavior of RTM Composites,” 6th International Conference on Marine Applications of Composite Materials (MACM‘96), March 19-21, 1996, Cocoa Beach, Florida.
  39. A.K.M. Mian, J. Suhling, and R. Jaeger, "The Use of van der Pauw Structures as Stress Sensors,"1999 International Mechanical Engineering Congress and Exposition, Nashville, TN, Nov. 14-19, 1999.

Invited Talks 

ASME-IoT Connect Conference, Santa Clara, CA, “3D Printing in IoT,” June 2016

Lamar University, Beaumont, TX, “Additive Manufacturing - Opportunities for Student Research,” November 2015

Air Force Research Lab, Dayton, OH, “Additive Manufacturing Research,” April 2015

Air Force Research Lab, Dayton, OH, “Electronic Packaging,” May 2014

Wright State University Physics Department, “Laser Micro-Processing: From Dissimilar Materials Joining to Additive Manufacturing,” Oct 2013

University of IL at Urbana Champaign, IL, “MEMS Based Measurement of Biofilm Rheological Properties,” May 2010

ASPEN Pointe Seminar Series, Montana, “The World of Small: Our Encounter with MEMS in Everyday Life,” February 2010

Three-Forks High/Middle School, Montana, “Continuing Education: Engineering as a Profession,” February 2010

Rajbari Girls’ High School, Bangladesh, “Inspiring High School Graduates in Higher Education,” January 2010

Center for Nanoscale Science and Engineering (CNSE), North Dakota State University, “Van der Pauw Structure as a Piezoresistive Sensor – Applications in Electronic Packaging Stress Measurements, MEMS Pressure Sensing and More,” May 2008

Montana State University, Bozeman, Montana, “Laser Microjoints between Implant Materials And their Mechanical Behavior in Cerebrospinal Fluid,” March 2007

Poster Presentations (*undergraduate student)

  1. A. Adeyemi, J. Thapa, T. Kanit, and A. Mian, “Effect of Environmental Conditions on Mechanical Properties of 3D Printed Glass Microfiber Reinforced Polyamide (PA-12) Composites,” 2025 MS&T Conference, Columbus, OH, October 2025
  2. A. Singh*, D. Young, and A. Mian, “Processing and Characterization of Conductive and Dielectric Inks for Inkjet Printing,” 2024 MS&T Conference, Pittsburg, October 2024.
  3. S. Ahsan*, V. Asam*, R. Srinivasan, A. Mian, and D. Young, “Additively Manufactured Inconel 718 and 316 Preforms for Forging operations,” 2024 MS&T Conference, Pittsburg, October 2024.
  4. V. Asam*, S. Ahsan*, R. Srinivasan, D. Young, and A. Mian, “Effect of Strain Distribution on Shape of the Preform using Finite Element Analysis,” 2024 MS&T Conference, Pittsburg, October 2024.
  5. L. Clark*, F. Ouchen, L. Davidson, O. Ranasingha, E. Heckman, C. Bartsch, and A. Mian, “Exposure of Aerosol Jet Printed h-BN/Polyimide Nanocomposite Films to Gamma Radiation,” 2024 MS&T Conference, Pittsburg, October 2024.
  6. L. Duncan*, and A. Mian, “Mechanical Reliability of Strain Sensors Printed Using Additive/Subtractive Hybrid Fabrication Method,” 2023 Celebration of Undergraduate & Graduate Research, Scholarship & Creative Activities, Wright State University, September 2023.
  7. L. Clark*, and A. Mian, “Direct Ink Write Processing of Signal Crossovers Using Aerosol Jet Printing Method,” 2023 Celebration of Undergraduate & Graduate Research, Scholarship & Creative Activities, Wright State University, September 2023.
  8. A. Singh*, D. Young, and A. Mian, “Processing of Silver Nanoparticle Ink for Inkjet Printing,” 2023 Celebration of Undergraduate & Graduate Research, Scholarship & Creative Activities, Wright State University, September 2023.
  9. V. Asam*, and A. Mian, “Additive Manufacturing for Printed Electronics,” 2023 Celebration of Undergraduate & Graduate Research, Scholarship & Creative Activities, Wright State University, September 2023.
  10. M. Muhammad, H. Huang, and A. Mian, "Inkjet Printed Ceramic/Polymer Nanocomposite Dielectrics," Nano + Additive Manufacturing Summit, Luiseville, KY, July 2023
  11. M. Hause*, S. Keerthi, J. Schrimpf, C. Graham, O. Ince, H. Yilmaz, M. Linder, L. Henry, G. Hansel-Schwaegerrle, R. Srinivasan, and A. Mian, “An NSF REU-RET Collaborative Project on Energy Absorption Behavior of 3D Printed Polymer Structures with Hierarchical Pores,” 2017 ASME International Mechanical Engineering Congress & Exposition, Tampa, FL, November 2017.
  12. B. Lewis*, J. Leary*, A. Bucher, C. Dickman, W. Petroski, A. Morneault, V. Bellows, D. Copeland, A. Mian, and R. Srinivasan, “Energy Absorption Capability of 3D Printed Polymer Structures with Sperical and Octahedral Pores,” 2016 ASME International Mechanical Engineering Congress & Exposition, Phoenix, AZ, November 2016.
  13. B. Lewis*, J. Leary*, A. Bucher, C. Dickman, W. Petrowski, A. Mian, and R. Srinivasan, “3D Printed Energy Absorbing Structures with Spherical Pores,” The 12th Annual Dayton Engineering Sciences Symposium (DESS), Dayton, OH, November 2016.
  14. B. Lewis*, J. Leary*, A. Morneault, V. Bellows, D. Copeland, A. Mian, and R. Srinivasan, “3D Printed Foam with Octahedral Pores,” The 12th Annual Dayton Engineering Sciences Symposium (DESS), Dayton, OH, November 2016.
  15. K. Blendsoe, D. Callinan, A. Turner, P. Kanagala, and A. Mian, “Electrical and Physical Characteristics of 3D Printed Conductive Polymers,” The 11th Annual Dayton Engineering Sciences Symposium (DESS), Dayton, OH, November 2015.
  16. S. Ahmed, H. Doak, A. Mian, and R. Srinivasan, “Influence of Process Parameters on the Mechanical Properties of Various Layers Processed Using Direct Metal Laser Sintering (DMLS),” 2014 Dayton Engineering Science Symposium, Dayton, OH, October 28, 2014.
  17. A. Hossain, and A. Mian, “Understanding Deformation Mechanism of a Microscale Cricket Filiform Hair Socket,” 2013 ASME International Mechanical Engineering Congress & Exposition, San Diego, CA, November 2013
  18. A. Hossain, and A. Mian, “Design Optimization of Microcantilever Beams for Measuring Rheological Properties of Viscous Fluid,” 2011 ASME International Mechanical Engineering Congress & Exposition, Denver, CO, November 2011
  19. L. Humphrey*, N. Carson*, and A. Mian, “Investigation of the Sensor Properties of Graphene,” The National Conference on Undergraduate Research (NCUR), Weber State University, Ogden, UT, Montana, March 29-31, 2012.
  20. L. Humphrey*, and A. Mian, “Investigation of the Piezoresistive Properties of Two-Dimensional Graphene Sheets,” 2011 Student Research Celebration, Montana State University, Bozeman, Montana, April 2011.
  21. E. Rashid*, and A. Mian, “Laser Microjoining of Dissimilar Materials using Diode Laser,” 2010 Student Research Celebration, Montana State University, Bozeman, Montana, April 8, 2010.
  22. E. Rashid*, and A. Mian, “Laser Microjoining of Dissimilar Materials using Diode Laser,” 24th National Conference on Undergraduate Research (NCUR), Missoula, Montana, April 15-17, 2010.
  23. J. Glenn*, C. Yirsa*, R. Pierce*, R. Cassel, and A. Mian, “Design of a MEMS Pressure Sensor Calibration Setup,” 2008 Student Research Celebration, Montana State University, Bozeman, Montana, April 2008.
  24. J. Law, and A. Mian, “Finite Element Analysis of Microjoint Bond Degradation in Cerebrospinal Fluid,” 2006 MRS Fall Meeting, Boston, MA

Industry Publications

  1. M. Lemecha, L. Goenka, J. Baker, A. Mian, and M. Balmforth, "Underhood Thermally & Acoustically Integrated Flatwire Electronics Packaging Concepts," Visteon Internal Publication, 2001.
  2. A. Mian, H. Singh, and P. Ramsagar, "A New Solution to the Flatwire-to-Round Wire Connection," Visteon Internal Publication, 2001.
  3. L. Goenka, M. Lemecha, A. Mian, and M. Howey, “Innovative Techniques for Packaging the Underhood Electronics with Enhanced Cooling Features,” Visteon Internal Publication, 2001.
  4. A. Mian, and A. Glovatsky, “Smart Packaging of Electronic Components for Vibration Isolation,” Visteon Internal Publication, 2001.
  5. A. Mian, “High Sensitive Sensor for Smart Pressure Sensing,” Visteon Internal Publication, 2001.
  6. A. Mian, L. Goenka, B. Belke, and P. Sinkunus, “Stiffened Low Cost Flexible Substrates for Fine Pitch IC Packages,” Visteon Internal Publication, 2000.
  7. R. McMillan, A. Mian, and A. Glovatsky, “Consolidated Alignment Features for Flexible Circuits,” Visteon Internal Publication, 2000.
  8. L. Goenka, A. Mian, and D. Hanson, “Parallel Water Injection and Cooling System for Fuel Cell Reformer,” Visteon Internal Publication, 2000.
  9. L. Goenka, A. Mian, W. Zhang, and M. Lemecha, “Simplified Valve Concepts for Fuel-Cell Reformer,” Visteon Internal Publication, 2000.